agilent HLMA-SH05 2 mm x 5 mm rectangular alingap lamps data sheet device selection guide viewing angle dominant package description 2 q 1/2 wavelength rectangular, 2mm x 5 mm, 110 615 nm tinted, diffused package dimensions 5.18 (0.204) 4.93 (0.194) 5.46 (0.215) 4.95 (0.195) 26.40 (1.00) min. 8.00 (0.315) 7.37 (0.290) 1.27 (0.060) nominal 2.41 (0.095) 2.03 (0.085) 2.23 (0.088) 1.98 (0.078) side view bottom view 0.46 (0.018) sq. nominal 2.54 (0.100) nominal cathode lead notes: 1. all dimensions are in millimeters (inches). 2. an epoxy meniscus may extend about 1 mm (0.040") down the leads. 3. there is a maximum 1?taper from base to the top of lamp. features rectangular light emitting surface excellent for flush mounting on panels long life: solid state reliability excellent uniformity of light output description the HLMA-SH05 is an epoxy encapsulated lamp in rectangular package which are easily stacked in arrays or used for discrete front panel indicators. contrast and light uniformity are enhanced by a special epoxy diffusion and tinting process. technology this 2x5 rectangular solid state lamp utilizes the newly developed aluminum indium gallium phosphide (alingap) led technology. this material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents.
2 absolute maximum ratings dc forward current [1] 50 ma peak forward current [2] 200 ma average forward current 45 ma (at i peak = 200 ma, f 1 khz) [2] transient forward current [3] 500 ma (10 s pulse) reverse voltage (i r = 100 a) 5 v led junction temperature 110 c operating temperature range -40 to +100 c storage temperature range -55 to +100 c notes: 1. derate linearly as shown in figure 4. 2. refer to figure 5 to establish pulsed operating conditions. 3. the transient peak current is the maximum non-recurring peak current the device can withstand without damaging the led die and wire bonds. figure 3. relative luminous intensity vs. foward current. figure 5. maximum average current vs. peak foward current. figure 2. forward current vs. forward voltage. figure 1. relative intensity vs. wavelength. figure 4. maximum forward current vs. ambient temperature. derating based on t max = 110 c. wavelength nm relative intensity 550 594 600 650 700 1.0 0.5 0 amber 630 reddish orange 621 20 v f forward voltage v 2 10 50 0 3.5 2.5 5 1 200 100 i f forward current ma 1.0 1.5 3.0 0.5 0.5 2.0 relative luminous intensity (normalized at 20 ma) 0 0 i f dc forward current ma 20 40 2.5 1.5 1.0 10 30 2.0 50 0.5 i f forward current ma 0 0 t a ambient temperature c 40 80 50 40 30 20 10 20 60 100 r ja = 618 c/w r ja = 412 c/w 5 15 25 35 45 10 30 50 70 90 i avg average current ma 50 0 i peak peak forward current ma 150 60 40 30 20 10 100 200 f > 1 khz f > 300 hz f > 100 hz 50
3 optical characteristics at t a = 25 c color, dominant viewing angle luminous luminous intensity peak wavelength wavelength 2 q 1/2 efficacy part number i v (mcd) @ 20 ma l peak (nm) l d [1] (nm) degrees [2] h v hlma- min. typ. typ. typ. typ. (lm/w) sh05 8 20 621 615 110 263 notes: 1. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the color of the device. 2. q 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. electrical characteristics at t a = 25 c reverse capacitance speed of response forward voltage breakdown c (pf) t s (ns) part v f (volts) v r (volts) v f = 0, thermal time constant number @ i f = 20 ma @ i r = 100 a f = 1 mhz resistance e- t/ t s hlma- min. typ. min. typ. typ. r q j-pin ( c/w) typ. sh05 1.9 2.4 5 20 40 260 13 figure 6. normalized intensity 1.0 0 angular displacement degrees 0.8 0.6 0.5 0.7 0.2 100 90 0.1 0.3 0.4 80 70 60 50 40 20 10 0 30 10 20 30 40 50 60 70 80 90 100 0.9
precautions lead forming ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering conditions ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. ? recommended soldering conditions: ? wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. ? if necessary, use fixture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25 c, before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through hole sizes for led component leads: manual solder wave soldering dipping pre-heat temperature 105 c max. C pre-heat time 30 sec max. C peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max. led component plated through lead size diagonal hole diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch) 0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. figure 7. recommended wave soldering profile. laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 01020 30 50 100 150 200 250 30 40 50 time seconds temperature c 60 70 80 90 100 top side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma note: allow for boards to be sufficiently cooled before exerting mechanical force. 4
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152(domestic/interna- tional), or 0120-61-1280(domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ? 2002-2005 agilent technologies, inc. obsoletes 5989-3269en november 14, 2005 5989-4267en
|
